Pump-Laser Welding Equipment
Product classification:Semi-conductor
Function Overview:
====【Application】
This equipment is used in the semiconductor field for tin sheets and chips welding by laser after being packaged to the pump.
product details
==== 【Functions and Features】
1. Accuracy of tin sheet & chip taking and placing (0~0.05MM, offset Angle ≤0.4°);
2. Visual guidance, incoming materials antidumbness (lack of materials, positive and negative side automatic identification) , shell code scanning and loading; SN code and visual judgment can be checked;
3. The equipment can be compatible with 2 kinds of waffle boxes and 3 kinds of heat sink chips. The product parameters can be set and the model can be changed at any time on the touch panel.
4.TT≤120S, Yield≥99.97%.