Connected Hot Pressing Curing Equipment
Product classification:Bonding
Function Overview:
====【Application】
This equipment is used for hot pressing curing of products after upstream equipment finishing dispensing in the field of camera modules.
product details
==== 【Functions and Features】
1. Analog module PID temperature control: 0~200°C is adjustable, temperature control accuracy: ±1°C, copper indenter temperature uniformity: ±3°C;
2. Heating method: upper and lower pressure head heating at the same time; Curing method: carrier intergrated curing, curing time 2Min;
3. Loading mode: carrier loading through flow line track, unloading mode: carrier entering the magazine for caching;
4.UPH≥100Pcs；
5. Production information, process parameters, abnormal alarm, QR code of jointed plate, product SN code and other information will be uploaded to the MES system.